
The Biden administration is launching a $1.6 billion funding competition for chip packaging research and development projects, marking the latest attempt to revitalize the domestic semiconductor industry.
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The Biden administration is launching a $1.6 billion funding competition for chip packaging research and development projects, marking the latest attempt to revitalize the domestic semiconductor industry.
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New guidance from the NCSC outlines a three-phase timeline for organisations to transition to quantum-resistant encryption methods by 2035. Source link
Teams from across the UK have been crowned CyberFirst Girls Competition champions. Source link